Device Drivers Books
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essential for device drivers and other NT internalsReview Date: 2005-08-27
Must haveReview Date: 2002-04-01
plotter driver for hp7550a under nt or for wp 5.1Review Date: 2000-02-11
We have an plotter printer HP 7550a and we run NT as operating system. There are no drivers for nt for this printer.
We now are trying to get this printer working under wp 5.1 because there are no printer drivers for NT.
Who can help me get the driver I am looking for. It does not matter if it is an NT driver or an corel wp5.1 driver.
Please help me we would realy appriciate this efford !
with kind regards,
Jeropen van Mourik
ING BANK Netherlands
ExcellentReview Date: 2000-04-18
Cool book, I found it very usefulReview Date: 2001-02-05

Used price: $39.97

embedded device driversReview Date: 2008-07-17
This book, give more information than linux device drivers, another iformations for the new developers, that are starting developing emebedded systems based on Linux.
So buy it.
The very BESTReview Date: 2008-07-13
A 'must have' for any collection serious about Linux programming applications.Review Date: 2008-06-20
Diane C. Donovan
California Bookwatch
A very clear and complete explanation.Review Date: 2008-05-05
I specifically liked:
1. the way the author ties all the pieces together. For example, in the PCMCIA subsystem, the diagrams give you the broader picture architecturally, and the code snipppets give you the minutia you'll need. 2. the fact that it is up-to-date as far as the kernel version is concerned.
3. how it resolved a lot of questions I'd had about the scheduler.
4. the really good handling of USB and the video subsystem.
It is a little light on SMP and portability issues, but overall a very good book.
Best Linux device driver book yetReview Date: 2008-05-06
To some extent, that's unavoidable: the Linux kernel is monstrous and very complex, and the hardware that drivers control can also be dark and mysterious territory.
I really appreciated this books approach. It's not that everything is explained in complete detail; that would be impossible. However, the author obviously tries very hard to give an overview, an orientation that will hopefully set your mind in the right direction, before diving into details. Throughout the book he adds "go look at this" suggestions that can help you understand whatever he's dealing with at this point.
I think Chapter 2, which is a high level fly-by of the kernel in general, is an absolute masterpiece. That starts by pulling typical kernel boot messages and explaining what they mean and what's going on in code to produce them. It then goes on to discuss kernel locks, briefly looks at procfs and memory allocation, and closes (as each chapter does) with pointers to where to look in the source for the subjects discussed.
Chapters 3 and 4 flesh out basic concepts more, and then after that the book goes into details, picking both real world and fanciful examples of hardware and giving sample device drivers. Simple devices are presented first, while later chapters get into more complicated hardware, but in each case the same general format is followed: overview of the how and why, sample driver(s), how to most easily debug, and pointers to real kernel sources.
Very well done. I have no complaints - oh, a few minor typos, maybe, but nothing serious.

Used price: $3.36

One-of-a-kind book not supplanted by more recent textsReview Date: 2005-12-12
Complete Examples, and Much MoreReview Date: 2001-01-04
Plain English, thoughtful flow of topicsReview Date: 2001-10-04
In teaching the subject, I often find it difficult to slow students down, and get them to confine their questions to one problem domain at a time. Device drivers have to fit into the kernel subsystem and communicate with a device through interrupts; there are LOTS of side questions people can dream up.
This book gave me a few insights into containing the discussions and forestall all that anxiety. Well worth the wait to get the book.
One of the best book for learning UNIX drivers.Review Date: 1999-04-24

A really first-rate novel by a first-rate writerReview Date: 1999-06-18
Fiction and Philosophy together is priceless.Review Date: 2000-10-06


Better than Godot.Review Date: 1999-08-13

Used price: $99.95

It is the best to get information about WDM!Review Date: 2000-05-15
Used price: $39.94

Power Electronics : Devices, Drivers and ApplicationsReview Date: 2001-04-19

This book was never published.Review Date: 2005-02-28

Used price: $25.00

Good bookReview Date: 2008-06-08
AwesomeReview Date: 2008-05-27
Understanding the Linux KernelReview Date: 2008-03-20
Great book on the design of the linux kernelReview Date: 2008-01-07
This book might melt your brainReview Date: 2008-02-16
I would give it 4 stars but it's not quite as well written as some of the other books on Free software published by O'Reilly.


Very good on hand referenceReview Date: 2002-02-01
Finally, THE Area Array Packaging Handbook is outReview Date: 2002-01-29
I particularly loves the the way the arthur organizes the content. Each packaging technology is covered in their own chapter. The chapter starts with an introduction and background, the materials and processes in the making of the packages, the applications and the limitations, the process, materials like solder pastes and fluxes and equipments needed to assemble these packages.
This book is design for both packaging house and Assembly house. It is also very useful for Failure Analysis guys as well as this book enables the reader to "see" the construction, and henceforth the possible weakness, of each of the packages.
All in all, this book is written for wide range of readers, from novice to R&D guys, this book covers it all.
Handy Packaging HandbookReview Date: 2002-01-31
The book brings together contributions from many of those disciplines by many talented contributors. The 38 authors include widely-known industry stars, such as Marie Cole, Dan Baldwin, Joe Fjelstad, Jennie Hwang, Wayne Johnson, Jan Vardaman, and Phil Zarrow, as well others equally expert in their own fields, if lesser known. Of course, the multi-talented Dr. Gilleo contributed several chapters, while editing the volume and riding herd on 37 cats.
The subjects covered begin with package concept and design and move through many of the intermediate stages of development and manufacture, to yields, costs, and markets. The 31 chapters are grouped into five major sections, following the flow from concept to markets.
Concepts and Design ranges in time from the pre-history of microelectronics (vacuum tubes) to the future history of packaging for current developments such as MEMS (microelectromechanical systems). After an industry overview and trends, chapters are devoted to each a wide variety of packaging, including arrays, stacked 3-dimensional, compliant ICs, and MEMS. Ken Gilleo gives a good overview of flip chip, and Marie Cole explains ceramic column grid arrays.
Materials addresses packaging ingredients. Coverage includes polymers, hermetic getters, the care and feeding of solder spheres, lead-free formulations (including their social and economic consequences), and conductive adhesives. Jennie Hwang's 59 page chapter on solder and solder paste is practically a book in itself.
Equipment and Processes is the largest section, with 11 chapters. It begins with Dan Baldwin detailing next-generation flip chip, and Wayne Johnson describing substrate design, assembly, underfills, and reliability. Rework includes chapters both for die attach rework and for BGA and CSP packages rework. Encapsulation, process development and control, and reliability have separate chapters, as do molding, screen printing and stenciling, high speed package mounting, and ovens.
Economics and Productivity begins with metrics: how to measure productivity, if any. The following chapter on cost estimating shows how to convert that productivity to profits. Both disciplines are overlooked in many texts and most companies.
Future considers the direction and destiny, both of electronic packaging and of packaging equipment, but not of the human race, and finds it pleasing. Convergences and their consequences on future packaging, and the expected evolution of SMT equipment, bring our forward-looking saga to a close.
The handbook format allows the experts to present their topics in free-standing chapters, as if they were consultants leaning over your shoulder. This format provides more practical detail than the broader but less specialized textbook format, at some sacrifice of the textbook's breadth and structure. These chapters vary in both the scope of the subject matter and in the depth of the presentation, ranging from 7 to 100 pages (mean = 24.06 pages, sigma =17.44 pages). The 400 illustrations (mean = 0.5 per page) make for easier understanding of the sometimes complex detail. Chapter-end references supply alternative sources for exploring further along these or tangential paths.
In summary, I recommend this book for gaining an understanding of the current state-of-the-art in these three packaging technologies, as an excellent reference for a wide variety of packaging topics, and as a valuable tool for solving present packaging problems and avoiding future ones.
Related Subjects: Companies Peripherals
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